How To Add PCB Test Points To Improve System Testability

Design For Testability (DFT) is the engineering practice of designing systems to optimize their bench-top testability. By bench-top testability we mean the ability to capture signals from the device (e.g. RTT or serial logs, voltage levels, current levels, GPIO, optical recognition, etc.) that we wouldn’t be able capture during field testing.

Implementing DFT into your design makes it significantly easier to set up testing. This then drives a virtuous cycle of deploying tests (because they’re easy to set up) and finding issues (which then justifies the resources for deploying more tests…).

For embedded systems DFT is often synonymous with simply adding more test points to the PCB. Although there are other ways improve an embedded system’s DFT, adding more test points is actually a great way to significantly increase your system’s test coverage.

If you want to take advantage of a bed-of-nails tester for accessing your test points, keep the following guidelines in mind:

Parameter Description Recommended Design Maximum Allowable Design Risk at Maximum Allowable Design
PCBA sides to be probed The number of PCBA sides which the fixture must make electrical contact with (Top, Bottom or Both) Single side probing is recommended. Probing of both sides of a PCBA is possible but should be avoided if the DUT design permits. Accuracy and Maintenance: Probing of both sides of a PCBA increases the risk of misalignment and may require more frequent fixture maintenance.
Cost: Fixtures will generally cost more as two precision probe plates are required as opposed to one.
Probe Contact Spacing The distance between the center-point of the nearest contacts to be probed on a PCBA 0.1” (2.54mm) Probe Point Spacing is recommended and considered standard 0.05” (1.27mm) Probe Point Spacing minimum is possible but should be avoided if the DUT design permits. Accuracy and Maintenance: Probing with smaller pitch probe contacts (and therefore smaller contact targets) increases the risk of accuracy issues. Smaller spacing probes are more fragile and may require more frequent maintenance.
Cost: Smaller spacing probes are more expensive.
Probe Contact Target Size The dimensions of the PCB contact test point which are to be probed >=0.04” (1.01mm) 0.03” (0.76mm) diameter contact test points minimum Accuracy and Maintenance: Probing of very small diameter test points may cause inconsistent testing as each DUT and fixture itself will have mechanical stackup variations.
Probe Contact Distance to Components or PCB Edge The distance of the probe centerpoint to the edge of a nearby component of PCB edge >=0.1” (2.54mm) distance minimum is recommended >0.075” (1.9mm) distance minimum is possible but not recommended Accuracy and Maintenance: Probing very closely to a nearby component or PCB edge may risk unexpected electrical contact to component sides.
Probe Voltage and Current Limits The voltage and current of any one contact test point on the DUT <= 30V DC, <=1.0A DC <= 60V DC, <=2.0A DC. Higher voltage/current is possible but not recommended without special contact probes. Accuracy and Maintenance: Higher voltage and higher current contacts may cause premature failure of spring loaded contacts
Cost: Higher voltage/current probes are more expensive.
Quantity of Probe Contact Targets The quantity of total PCBA locations to be probed by the fixture <=50 <100 Accuracy and Maintenance: The cumulative force of large quantities of pogo pins may stress the fixture itself.
Cost: Smaller spacing probes are more expensive.
DUT: High quantities of spring loaded contact probes may cause the DUT to flex and damage components or the PCB itself.
PCBA Manufacturing Clean Process The specified cleaning process of a PCBA after solder/reflow Recommend clean process “No Clean” is possible but not recommended Accuracy and Maintenance: Flux residue on a PCBA which has not been cleaned can interfere with probe contacts, and worse can reduce the lifetime of test fixture probes.
PCB Thickness The maximum thickness of the DUT PCB 0.063” (1.6mm) standard PCB thickness recommended 0.039” (1.0mm) PCB thickness is possible but not recommended DUT: Thinner PCB’s will tend to flex and deform more when the force of spring loaded contact probes are distributed across the PCB.
Cost: Additional fixture components may be necessary to adequately protect thinner DUT’s from mechanical stress or damage.
Locating Features Mounting or tooling holes in a PCB which the test fixture can use to accurately locate and align the DUT 2 Non-Plated Through Holes, 3.0mm diameter or greater 1 Non-Plated Through Hole, 3.0mm diameter or greater Accuracy and Maintenance: At least one non-plated through hole is required to locate the DUT for consistent probing.
PCBA Dimensions The maximum dimensions of the target PCBA <= 47mm x 105mm <= 65mm x 105mm Cost: Additional fixture fabrication steps may be required to accommodate larger PCBA’s Abnormally shaped PCBA’s may further limit the space which can be probed.
PCBA Component Height The maximum component height permitted from either side of the PCB <3.0mm maximum component height from either PCBA side <=4.5mm maximum component height from either PCBA side Cost: Additional fixture fabrication steps may be required to accommodate taller components

Finally, before sending out your board package, make sure your Gerber and Mechanical files have the right information:

Resource Description Information Required Format Required
PCB Gerber Files Exported gerber files of the target PCB to be probed.
Must utilize the same coordinate system and origin as all other CAD provided.
All relevant PCB layer gerber information, drill layers, component courtyards and silkscreen Extended gerber format
PCBA Mechanical Drawing A mechanical drawing of the target PCBA.
Must utilize the same coordinate system and origin as all other CAD provided.
Critical mechanical dimensions, origin location, tooling hole locations, PCB stackup. PDF or DXF

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